XC3S50AN-4TQG144I

spartan-3an FPGA, 1.2 to 3.3V, TQFP

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Price:: US $6.15~6.95 / piece [Get Latest Price]

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	US $6.15~6.95

PartNumber:: XC3S50AN-4TQG144I

Brand:: Xilinx, Inc - Xilinx | Pack: TQFP | D/C: 09+

Availability:: Supply Ability: 10000/Week Can Ship Immediately
Delivery: 10-15 Business Days (ships out within 3 Business days)

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Products Upload time: 2012-10-09

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Part Number:XC3S50AN-4TQG144I
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Product Summary

The XC3S50AN-4TQG144I is a member of spartan-3an FPGA family. The XC3S50AN-4TQG144I builds on the success of the earlier Spartan-IIE family by increasing the amount of logic esources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by proving clock management functions. The XC3S50AN-4TQG144I combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Parametrics

XC3S50AN-4TQG144I absolute maximum ratings: (1) Internal supply voltage Vccint: -0.5V to 1.32V; (2) Auxiliary supply voltage Vccaux: -0.5V to 3.00V; (3) Output driver supply voltage Vcco: -0.5V　to 3.75V; (4) Input reference voltage Vref: -0.5V, Vcco +0.5V; (5) Voltage applied to all User I/O pins and Dual-Purpose pins Vin: -0.5V, Vcco +0.5V, Voltage applied to all Dedicated pins Vin: -0.5V, Vccaux +0.5V; (6) Junction temperature Tj: 125°C (V< 3.0V) , 105°C (V>3.0V) ; (7) Soldering temperature Tsol: 220°C; (8) Storage temperature Tstg: -65°C to 150°C.

Features

XC3S50AN-4TQG144I features: (1) Revolutionary 90-nanometer process technology; (2) Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (3) Densities as high as 74,880 logic cells; (4) 326MHz system clock rate; (5) Three power rails: for core (1.2V) , I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V) ; (6) Seventeen single-ended signal standards ; (7) Eight global clock lines and abundant routing; (8) Fully supported by Xilinx ISE development system; (9) Synthesis, mapping, placement and routing; (10) MicroBlaze processor, PCI, and other cores.